AEMtec announces a major advancement in their wafer back-end manufacturing capabilities
The Adlershof-based company has implemented Electroless Under Bump Metallization (UBM) equipment in its own facility
AEMtec GmbH from Adlershof specialises in the development, industrialisation and production of complex microelectronic and optoelectronic modules through to complete systems. The UBM process is an integral part of the wafer back-end services offered by AEMtec. Implementing this process in-house will result in improved lead times and greater production versatility. With this important initiative increased flexibility, maximized productivity and enhanced equipment accessibility are ensured.
Integrating the UBM process in-house will allow new engineering requests to be developed with more efficiency in the three-shift production schedule. This strategic step represents a significant milestone in their ongoing commitment to innovation and cutting-edge technologies.
Qualification of the new UBM equipment will be complete in the third quarter of 2024.
Further information:
AEMtec GmbH
James-Franck-Str. 10, 12489 Berlin
+49 30 6392-7300
info(at)aemtec.com
www.aemtec.com
Credit: AEMtec, 19.06.2024